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Semiconductor Asia Summit · Next confirmed edition

Malaysia
2027.

8–9 April 2027 · Iconic Marjorie Hotel, Penang
Connect with semiconductor leaders, technology partners and investment decision-makers at our next summit.

Leadership forumsTechnology showcasesIndustry connections
2026 summit highlights · Historical footageWatch with sound →
Your next industry connection

The next chapter.
Malaysia 2027.

Semiconductor Asia Summit returns to Penang. Explore the programme and find your place in the next industry conversation.

NEXT CONFIRMED EDITION
When
8–9 April 2027
Where
Iconic Marjorie Hotel
Penang, Malaysia

Two days of semiconductor strategy, technology and industry connections.

Explore our previous editions

Two editions. One connected community.

Read the complete post-event reports online — speakers, delegates, companies and photographs.

Participants at the 2025 Semiconductor Asia Summit
2025

Kuala Lumpur · Post-Event Report

5–6 March 2025 · Malaysia

Explore the full report
Participants at the 2026 Semiconductor Asia Summit
2026

Penang · Post-Event Report

5–6 March 2026 · Malaysia

Explore the full report
The next connection

One industry.
A regional perspective.

Meet the people shaping semiconductor growth in Asia. Explore confirmed events and the next cities in our series.

01 / NEXT CONFIRMED EDITION

Penang,
Malaysia.

8–9 April 2027
Iconic Marjorie Hotel, Penang

MALAYSIA 2027Explore the summit →
A track record, not just a promise

The conversation is growing.

Read the 2026 report →
315+Attendees in 2026
196+Represented companies
48+Speakers
14+Sponsors & partners

2026 summit in numbers.

From architecture to scale

The full value chain.
In the same room.

Semiconductor Asia brings commercial strategy and technical capability together: the businesses building chips, the partners enabling production, and the institutions supporting growth.

01 / DESIGN & DEVICES

Build what comes next.

IC design, IP and EDA. AI accelerators, power and specialty semiconductors. Architecture choices that shape tomorrow’s products.

02 / PACKAGING & PRODUCTION

Turn potential into output.

Foundries, IDMs and OSATs. Chiplets, advanced packaging, inspection and test. Practical conversations about yield and ramp-up.

03 / FACTORIES & ECOSYSTEMS

Scale the whole system.

Equipment, materials, automation and factory infrastructure. Talent, investment and resilient supply chains across the region.

Foundries & IDMsFabless & IC designOSAT & advanced packagingEquipment & materialsGovernment & investmentResearch & talent
Previous editions

Real people.
Industry-wide conversations.

Explore the highlights, people and ideas from our first two editions.

The semiconductor industry together at the 2026 Penang summit

The 2026 edition, Penang · ESCOM Events

2026

Penang, Malaysia

5–6 March 2026 · Iconic Marjorie Hotel
Our second edition connected the industry in Malaysia’s semiconductor hub.

View post-event report →
See the industry in action

Event video.

A closer look at the Semiconductor Asia experience.

Watch on YouTube →

Your next industry connection

Be part of the
semiconductor conversation.

Discuss participation, speaking, sponsorship or a technology showcase with our team.

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The community, in their own words

Voices from past participants.

J-Wing Teh

J-Wing Teh

Director, Silicon Design Engineering

AMD2026 PARTICIPANT

AMD Malaysia had the opportunity to attend the Semiconductor Asia Summit 2026 in Penang, and it was encouraging to see the level of discussions happening across the semiconductor ecosystem.

Several themes stood out during the discussions:
• AI is reshaping chip demand, accelerating the shift of high-performance computing to rack level deployment for scale up and out.

• Southeast Asia continues to strengthen its role in the global value chain from IC design to assembly, testing, and packaging.

• Supply-chain resilience and talent development remain key priorities for both industry and policymakers to support the semiconductor industry development in the region.

Great conversations and insights from speakers and panelists across the ecosystem. Looking forward to seeing how the region continues to evolve in the years ahead.

Surya Vamsi Miriyala

Surya Vamsi Miriyala

WW Product Manager, IBM Asset Lifecycle Management

IBM2026 PARTICIPANT

Great to be back at the Summit 2026 in Penang, Malaysia — my second time representing IBM at this fantastic event, and once again an incredible platform for meaningful industry conversations.

This year, I had the privilege of contributing in two roles:
Moderator – Panel discussion on “Digital Transformation for Sustainability: Empowering the Semiconductor Industry through AI and Green Practices” with industry leaders from Intel and ViTrox Corporation
Panelist – Discussion on “Semiconductor Sustainability: From Factory Floor to Corporate Strategy” alongside leaders from STMicroelectronics and the Penang Green Council

The conversations highlighted how the semiconductor industry is increasingly integrating AI and advanced automation, with intelligent asset lifecycle management playing a crucial role in improving efficiency while meeting sustainability goals.

One key takeaway from the discussions was clear: Digital transformation and Sustainability are no longer parallel initiatives — they are becoming a unified operating model for modern chip manufacturers.

A big thank you to the organizers, fellow panelists, and the audience for such insightful discussions.

Dr. Murugappan

Dr. Murugappan

Chief Human Resources Officer

Malaysian Communications and Multimedia Commission2026 PARTICIPANT

Glad to have advocated at the invitation of Semiconductor Asia on value translation whereby a company's vision is the leader's dream which needs to be led through a planning, prioritizing and execution based on a skills first approach as avenue persists.
Was happy to have received many connections thru wa for touch base, networking and sparring. Front end semicon (wafer fab) has always been my passion since my Kulim Hi-Tech days.
You'll Never Walk Alone.

Chian Min Liong

Chian Min Liong

Managing Director

Renesas Electronics2025 PARTICIPANT

RENESAS ELECTRONICS AS PANELIST AT SEMICONDUCTOR ASIA SUMMIT 2025

Renesas was invited as a panelist at Semiconductor Asia Summit on Mar 5-6, 2025 at KL Pavilion Hotel to discuss about “Emerging Resilience in the Semiconductor Supply Chain in Asia and the World”.

Represented Renesas Malaysia & honoured to share the stage with esteemed Ir Dr Bernard Lim, J-Wing Teh & Shanmuganathan Palanisamy during the panel session.

Supply chain resilience is becoming increasingly important in today's business, especially in view of more global disruptions.

For Renesas, our supply chain resilience must incorporate the mindset of Agile, Innovative & Entrepreneurial (part of our TAGIE Culture values).

While such resilience requires holistic teamwork from internal functions, such as manufacturing operation, business planning, logistics, procurement, finance etc, we also need to work together with external parties.

With more than 50 years in Malaysia, Renesas has been leveraging on well-established local ecosystem (the supportive government agencies, state government, trade associations (such as MSIA, FREPENCA, AMCHAM) and a network of semiconductor suppliers) for supply chain resilience.

To further strengthen our supply chain, Renesas is also standardising ERP system across its various legacy entities to facilitate better end-to-end planning.

Automation, digitalization and supply chain intelligence are a must to better prepare for global disruption.

Collaboration across organisations and countries in Asia can serve to enhance collective resilience of our region, by sharing resources and leveraging on each other's strengths and value propositions.

Great exchange of ideas and a lot of knowledge sharing throughout Semiconductor Asia Summit!

Thanks Escom Events and Febby Azizah for the opportunity

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