ET Tan
Board Member
MIMOS Berhad
Post-event report · 2025
Kuala Lumpur.
One connected industry.
Asia’s Semiconductor Surge — Connecting Ideas, Powering Growth
A record of the summit
The edition at a glance.
Held on March 5–6, 2025 at Pavilion Hotel Kuala Lumpur, Semiconductor Asia Summit 2025 brought together semiconductor leaders, policymakers, manufacturers, equipment and materials providers, and researchers. The two-day programme combined keynotes, expert panels, technology presentations, an exhibition and networking around Asia’s semiconductor growth, advanced packaging, AI-enabled manufacturing, sustainability and talent development.
211Attendees
540Registrations
121Companies attended
30Speakers & panelists
13Solution providers
8Industry partners & endorsers
79%C-level decision makers
22Presentations & panels
188Day 1 attendees
125Day 2 attendees
Photo highlights
Moments from the summit.
Delegate profile
Who joined the conversation.
Leadership-led participation
The report identifies 79% of attendees as C-level decision makers, alongside representatives from semiconductor companies, technology providers, government and research.
Two days of industry exchange
188 attendees on Day 1 and 125 on Day 2, with 211 attendees overall. The programme included 22 presentations and panel discussions.
Speakers & contributors
Industry voices. Practical expertise.
Meet the speakers and contributors from this summit.
Mazlan Mokhtar
Director, Electrical & Electronics Division
Malaysian Investment Development Authority (MIDA)
J-Wing Teh
Director of Silicon Design Engineering
AMD
Gary Leong
Senior Director, Analytics Intelligence Solutions (AIS)
ViTrox Corporation Berhad
Susan Goh
Group VP, Central Materials Engineering
STMicroelectronics
Dominic Koey
Technical Director, Package Innovation
NXP Semiconductors
Chian Min Liong
Managing Director
Renesas Electronics
Tai Kian Chong
Marketing Director
NSW Automation
Eric Lee
President of the Sales Group
Scientech Corp.
Meng Kuang Koh
Chief Technology Officer
Alpha X Technology
Desmond Pan
Technical Specialist in Dispensing Solution and Automation Integration
Kulicke & Soffa
Melvin Tan
Technical Solution Manager
Kulicke & Soffa
Dr. David Lacey
Director, Advanced Development & Services, R&D
ams OSRAM
Dr. Poh Leng Eu
Senior Director, External Package Innovation, Chief Technology Office
NXP Semiconductors
Dr. Plex Lee
Applications Team Leader
Malvern Panalytical
Dr. Angie See Tien Ng
AI Principal Engineer, Technical Director & Application Engineering Lead
Intel Corporation
Ir. Dr. Bernard Lim
Vice President, IEM; Advisor & Lead Consultant, South East Asia, IPC
The Institution of Engineers, Malaysia (IEM) / IPC
Dr. Ranee Ramya
Head of Country, Malaysia
IPC International Inc.
Soon Lee Yeap
Executive Vice President
Oppstar Berhad
Davis Chong
President, MPIA; Executive Director & Group CEO, Solarvest
Malaysian Photovoltaic Industry Association / Solarvest Holdings Berhad
Dr. Murugappan
Chief Human Resources Officer
Malaysian Communications and Multimedia Commission
Datuk Ginie Lim
Chief Executive Officer
Invest Melaka
Kee Sim Cheng
Manufacturing Chief Engineer, FPGA & Test Foundry Office
Altera
Dato' Ts. Dr. Shanmuganathan Palanisamy
Chairperson, Strategic Initiatives Pillar 1 (E&E Value Chain); Founder & CEO, ECTrons
E&E Productivity Nexus (EEPN) / ECTrons
Angel Low
General Manager
Advanced Semiconductor Academy of Malaysia (ASEM) / AI Nusantara
Assoc. Professor Ts. Dr. Mohd Zamir Pakhuruddin
Director
Institute of Nano Optoelectronics Research and Technology (INOR), Universiti Sains Malaysia
Jaffri Ibrahim
Founder & CEO
Collaborative Research in Engineering, Science and Technology (CREST)
Dr. Chin Seong Lim
Malaysia Director, Head of Electrical & Electronic Engineering
University of Nottingham
Sivavenayakam Velayutham
Executive Committee
Malaysia-Japan Economic Association (MAJECA)
Adlil Aizat
Program Manager, Product Development
Sandisk (Western Digital)
Surya Vamsi
WW Product Manager, IBM Asset Lifecycle Management
IBM
Bryan Shackmuth
Senior Product Line Manager (video presentation)
Nordson Test & Inspection
Malini Ramalingam
Director
MCMC Academy
Topics & programme
Two days across the value chain.
Asia’s semiconductor market trends and ecosystem
Malaysia’s semiconductor expansion
Technology advancement
Advanced packaging solutions
Packaging innovations
Future of test engineering
AI in semiconductor manufacturing
Intelligent manufacturing and sustainability
Local talent-pool development
Two-day programme
Day 1 · 08:00
Registration & Morning Coffee
Day 1 · 08:55
Opening Remarks
Ir. Dr. Bernard Lim
Day 1 · 09:00
The Shifting Global Semiconductor Landscape in Asia-Pacific
ET Tan
Day 1 · 09:20
Nordson presentation slot (agenda label)
Nordson; report p17 identifies Bryan Shackmuth’s AMI video presentation
Day 1 · 09:50
Emerging Resilience in the Semiconductor Supply Chain in Asia and the World
Ir. Dr. Bernard Lim; Chian Min Liong; J-Wing Teh; Dato’ Ts. Dr. Shanmuganathan Palanisamy
Day 1 · 10:30
Morning Tea Break
Day 1 · 11:00
Redefining Dispensing Solutions for the Semiconductor Industry
Desmond Pan
Day 1 · 11:20
Efficiency and Sustainability in Silicon Carbide Wafer Production by Way of Rapid Crystal Orientation Analysis by Azimuthal XRD Scanning
Dr. Plex Lee
Day 1 · 11:40
Digital Transformation for Sustainability: Empowering the Semiconductor Industry through AI and Green Practices
Sivavenayakam Velayutham; Davis Chong; Surya Vamsi
Day 1 · 12:20
Lunch Break
Day 1 · 13:40
Manufacturing Foundation System Readiness for Advanced Packaging
Meng Kuang Koh
Day 1 · 14:10
Advanced Chip Packaging: How Manufacturers Can Play to Win
Dr. Ranee Ramya; Ir. Dr. Bernard Lim
Day 1 · 14:20
Adapting to 21st Century E&E Advanced Packaging Trends: Leveraging NSW’s Next-Generation Micro-Dispensing Technologies for Emerging Innovations
Tai Kian Chong
Day 1 · 15:10
Afternoon Tea Break
Day 1 · 15:40
Transformation Through Innovation in Automotive Semiconductor Packaging
Dr. Poh Leng Eu
Day 1 · 16:10
The Power of AI in Semiconductor Manufacturing
Angel Low; Gary Leong; Dr. Angie See Tien Ng; Kee Sim Cheng
Day 1 · 16:50
Closing Remarks + Post Event Networking
Day 1 · 17:10
End of Day One
Day 2 · 08:00
Registration & Morning Coffee
Day 2 · 08:55
Opening Remarks
Dato’ Ts. Dr. Shanmuganathan Palanisamy
Day 2 · 09:00
Malaysia’s Electrical & Electronics Sector: Semiconductor
Mazlan Mokhtar
Day 2 · 09:30
Heterogeneous Integration (HI): Challenges and Advances
Eric Lee
Day 2 · 09:50
Sustainable Semiconductor/Electronic Manufacturing
Dr. Chin Seong Lim; Susan Goh; Jaffri Ibrahim
Day 2 · 10:30
Morning Tea Break
Day 2 · 11:10
Interconnect with Vertical Wire
Melvin Tan
Day 2 · 11:30
The Future of Semiconductor Packaging: Advanced Techniques and Materials
Assoc. Professor Ts. Dr. Mohd Zamir Pakhuruddin; Dominic Koey; Dr. David Lacey; Adlil Aizat
Day 2 · 12:20
Lunch Break
Day 2 · 13:40
Melaka Industries and Sustainable Transformation
Datuk Ginie Lim
Day 2 · 14:10
Talent Pipeline: Building a Skill Based Sustainable Workforce
Workforce development and digital skills
Day 2 · 14:40
Afternoon Tea Break
Day 2 · 15:25
IC Design & Services in Southeast Asia vs International Market Demand
Soon Lee Yeap
Day 2 · 16:00
An Introduction of IEM & The Pathway of Becoming a Professional Engineer
Ir. Dr. Bernard Lim
Day 2 · 16:30
Lucky Draw Session
Day 2 · 16:50
Closing Remarks
Day 2 · 17:00
End of Day Two
Session highlights
From ideas to industry priorities.
Asia-Pacific semiconductor landscape
ET Tan discussed supply-chain diversification, advanced packaging, AI demand and the growing role of ASEAN semiconductor ecosystems.
Supply-chain resilience
Industry leaders from Renesas, AMD, EEPN and ECTrons joined a panel moderated by Ir. Dr. Bernard Lim on resilience across the Asian and global supply chain.
Dispensing and silicon-carbide metrology
Kulicke & Soffa and Malvern Panalytical presented dispensing automation and rapid crystal-orientation analysis for silicon-carbide wafer production.
Digital transformation and sustainability
MAJECA, MPIA/Solarvest and IBM discussed how AI and green practices can support more sustainable semiconductor manufacturing.
Scaling advanced packaging
Alpha X Technology, IPC and NSW Automation explored factory-system readiness, packaging standards, chiplets, heterogeneous integration and micro-dispensing technologies.
Automotive semiconductor packaging
Dr. Poh Leng Eu examined packaging innovation for smart mobility, including heterogeneous integration, thermal performance and energy efficiency.
AI in manufacturing
Intel, ViTrox and Altera discussed AI applications in semiconductor manufacturing, moderated by Angel Low.
Malaysia’s E&E sector
Mazlan Mokhtar presented Malaysia’s semiconductor ecosystem, investment priorities, National Semiconductor Strategy and future capability development.
Heterogeneous integration and sustainable manufacturing
Scientech addressed integration challenges; STMicroelectronics and CREST joined the discussion on sustainable electronics manufacturing.
Packaging techniques and materials
NXP, ams OSRAM and Sandisk discussed advanced packaging; Kulicke & Soffa presented vertical-wire interconnect technology.
Melaka industry and talent development
Invest Melaka discussed industrial development and sustainability. Malini Ramalingam of MCMC Academy presented workforce development and digital skills.
IC design and professional engineering
Oppstar explored regional IC-design opportunities. IEM addressed professional recognition, accreditation, continuous learning and engineering networks.
Attending companies
The organisations in the room.
Academy Semiconductor of MalaysiaAdvanced Micro Devices Sdn BhdAdvanced Semiconductor Academy of Malaysia (ASEM)AdvantitechAemulus Corporation Sdn BhdAerotechAIR SELANGORAL-AZIMAlpha X TechnologyAltera CorporationAMD Global ServicesAmkor Technology Malaysiaams OSRAMams-osramAnalog DevicesAT&S Austria Technologie & Systemtechnik (M) Sdn. Bhd.British High CommissionBroadcomBursa Malaysia BerhadCarsem (M) Sdn BhdCentrotherm InternationalConnexusCREST@MITIDWH Group BerhadE&E Productivity Nexus (EEPN)Embassy of the Kingdom of the NetherlandsFlapmax Semiconductors – AI & IC Design InnovationsGamuda Land Sdn BhdGlobal Foundries Singapore Pte. Ltd.GMX Capital GroupGrabTaxiHanic Sdn BhdHenkelHitachiIBMInfineon TechnologiesInfineon TechnologyInsignia Ventures PartnersInstitute of Nano Optoelectronics Research and Technology (INOR)Intel CorporationIntel MicroelectronicsINTEL TECHNOLOGY SDN BHDInvest MelakaInvest Selangor BerhadIPC International Inc.Key ASIC BerhadKriptic Devices Sdn BhdKulicke & SoffaLattice Semiconductor Sdn BhdMAJECA (Malaysia-Japan Economic Association)Malaysia Digital Economy Corporation (MDEC)Malaysian Communication and Multimedia CommissionMalaysian Dutch Business CouncilMalaysian Technology Development Corporation Sdn. Bhd. (MTDC)Malvern PanalyticalMDBCMettler ToledoMicrochipMicron Memory MalaysiaMicron Semiconductor Sdn.Bhd.Micron TechnologyMIDAMIMOS Services Sdn BhdMTDCNefab Malaysia Sdn. Bhd.Netherlands Embassy in Kuala LumpurNexperia Malaysia Sdn BhdNordsonNSW Automation Sdn. Bhd.NTTNXP Malaysia Shd BhdON Semiconductor MalaysiaonsemiOnsemi KLOPPSTAR BERHADOSRAM SEMICONDUCTOR (m)SDN BHDPacific Adhesive SystemsPDF Solutions KKPENGURUSAN AIR SELANGOR SDN BHDPentamaster Cooperation BerhadPrime Ministers DepartmentPVA TePla AGRenesas Semiconductor KL Sdn. Bhd.S.E.H. Shah Alam Sdn BhdSamsung SemiconductorSandisk (Western Digital Batu Kawan)Scientech CorpSEH (SA) Sdn. Bhd.Selangor Information Technology and Digital Economy CorporationSETSCO SERVICES PTE LTDSidecSIDEC Sdn BhdSignOff SemiconductorsSilicon Island Development Sdn BhdSilTerraSilTerra Malaysia Sdn. BhdSILTERRA MALAYSIA SDN. BHD.SkyeChipSMD Semiconductor Sdn BhdSTMicroelectronicsSustio@Simmtech Sdn. Bhd.Symphony Engineering SDN. BHD.TalentCorpTecab CDMO Solutions PN Sdn. Bhd.TekmarkTERA VA Sdn BhdTEXAS INSTRUMENTS MALAYSIA SDN BHDTexas Instruments MelakaTF-AMD PenangThe Collaborative Research in Engineering, Science and Technology Centre (CREST)The Edge MalaysiaThe Institution of Engineers, Malaysia (IEM)University of NottinghamViTrox Corporation BerhadX-FAB Sarawak Sdn.Bhd.YayatechMalaysian Investment Development Authority (MIDA)Malaysian Photovoltaic Industry Association (MPIA)
Sponsors, exhibitors & supporters
The partners behind the platform.
Gold
Malvern PanalyticalNSW Automation
Silver
Nordson Test & InspectionKulicke & SoffaAlpha X TechnologyScientech Corp.
Exhibitor
TERA VATekmarkGrab for BusinessPacific Adhesive SystemsPVA TePlaSignOff Semiconductors
Attending specialist
Aerotech
Partners & supporters
IPCThe Institution of Engineers, Malaysia (IEM)Malaysian Technology Development Corporation (MTDC)PCB DirectoryAsia Business OutlookCEO InsightsEE Times Asia / EDN Asiae27
Malvern Panalytical
Materials-characterization and wafer-metrology solutions, including X-ray fluorescence, X-ray diffraction and crystal-orientation analysis.
NSW Automation
Precision liquid-dispensing systems for microelectronics and semiconductor manufacturing, including programmable volumetric dispensing and micro-volume squeezing technologies.
Nordson Test & Inspection
Acoustic, optical and X-ray inspection systems, component counting and semiconductor measurement technologies.
Kulicke & Soffa
Semiconductor, LED and electronic-assembly solutions, including interconnect technologies supporting performance, power efficiency and device miniaturization.
Alpha X Technology
Automation, logistics and AI-enabled manufacturing solutions spanning factory modelling, equipment integration, material transfer, process control and maintenance.
Scientech Corp.
Wet-process semiconductor equipment and temporary bonding/debonding technologies for advanced packaging, fan-out and heterogeneous integration.
TERA VA
Renewable solar-energy solutions for industrial, commercial and residential facilities, supporting energy efficiency and lower electricity costs.
Tekmark
Technology solutions spanning test instruments, electronic-product design, software testing and industrial automation.
Grab for Business
Business services for managing corporate rides, employee food programmes and related company spending.
Pacific Adhesive Systems
Specialty adhesives and associated dispensing, coating, mixing, plasma and curing equipment for electronics and other high-performance applications.
PVA TePla
Acoustic microscopy for non-destructive material testing, semiconductor inspection and failure analysis.
SignOff Semiconductors
VLSI and embedded-design services covering physical design, analog/digital layout, RTL, verification and embedded solutions.
Aerotech
Precision motion-control and automation technologies for manufacturing, testing and inspection at micrometre and nanometre scales.
Participant voices
Participant perspectives — highlights.
Highlighted supply-chain resilience, agility, digitalization and collaboration across regional ecosystems.
Chian Min LiongRenesasReflected on panel discussions linking AI, sustainable manufacturing and green practices.
Surya VamsiIBMDiscussed supply-chain risks, digitalization and global collaboration.
J-Wing TehAMDDescribed participation in advanced packaging discussions and knowledge sharing.
Assoc. Professor Ts. Dr. Mohd Zamir PakhuruddinINOR / Universiti Sains MalaysiaContinue the conversation
Meet the industry
at the next edition.
8–9 April 2027 · Iconic Marjorie Hotel, Penang
Explore Malaysia 2027 →Cassie Mei
Project Director
E: cassie.mei@escom-events.com
P: (86) 13564740295 (WhatsApp)
escom-events.com
Project Director
E: cassie.mei@escom-events.com
P: (86) 13564740295 (WhatsApp)
escom-events.com